[Package Science Services] Peers Perspective - Thermal challenges in modern electronics design
Tom Tarter, President of Package Science Services LLC, discusses thermal challenges in modern electronics design, such as devices in a system becoming increasingly smaller. Siemens Digital Industries Software solutions, including Simcenter™ FLOEFD™, can be used to improve workflow, simulate ‘what-if’ scenarios, and ultimately save costs for an organization.
#SimcenterConsumerProducts #Electronics #Electrical #CFD #ThermalEngineering
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