Uncovering 2.5D and 3D IC Tests | 3D IC Podcast

Shifting left to integrate testing as early as possible in the design cycle is one of the best ways to speed up product development. A shift-left strategy is critical complex designs with multiple dies integrated into a package. This episode of the Siemens 3D IC | The Future of semiconductor design podcast discusses the challenges and opportunities for performing comprehensive tests on 2.5D and 3D IC designs. Learn about the factors teams need to consider when planning for 3D design-for-test (DFT) and IP tests. About Siemens 3D IC Design Flow: a comprehensive set of tools and workflows targeted to develop advanced 2.5 and 3D IC heterogeneous system-in-package (SIP) designs. Explore more about Siemens EDA's marketing-leading 3D IC technology solution: https://sie.ag/3IQQigf #chiplets #semiconductor #icpackaging #advancedpackaging #3DICdesign #3dic #eda LEARN MORE: https://sie.ag/3IOWNjq ►INDUSTRY PAGE: https://sie.ag/3DOf9yH ►CHIPLET MODEL WHITEPAPER: https://sie.ag/3P6vClC FOLLOW US: ►BLOG: https://sie.ag/3sIVkCz ►LINKEDIN: https://sie.ag/3Fwoufo